The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
Mar. 31, 2011
Yukihiro Maeda, Kasugai, JP;
Kouji Kondoh, Toyohashi, JP;
Yoshiharu Harada, Okazaki, JP;
Takeshi Yamauchi, Nagoya, JP;
Tetsuo Fujii, Toyohashi, JP;
Yukihiro Maeda, Kasugai, JP;
Kouji Kondoh, Toyohashi, JP;
Yoshiharu Harada, Okazaki, JP;
Takeshi Yamauchi, Nagoya, JP;
Tetsuo Fujii, Toyohashi, JP;
Denso Corporation, Kariya, JP;
Abstract
A circuit board includes an insulating member and a semiconductor chip encapsulated with the thermoplastic resin portion of the insulating member. A wiring member is located in the insulating member and electrically connected to first and second electrodes on respective sides of the semiconductor chip. The wiring member includes a pad, an interlayer connection member, and a connection portion. A diffusion layer is located between the first electrode and the connection portion, between the pad and the connection portion, and between the second electrode and the interlayer connection member. At least one element of the interlayer connection member has a melting point lower than a glass-transition point of the thermoplastic resin portion. The connection portion is made of material having a melting point higher than a melting point of the thermoplastic resin portion.