logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6434006 B1

PDFFull Text
Date of Patent:
Aug. 13, 2002

Filed:

May. 02, 2001

Semiconductor device having heat radiating member

Applicant:
Inventors:

Akihiro Fukatsu, Anjo, JP;

Kan Kinouchi, Okazaki, JP;

Mitsuhiro Saito, Obu, JP;

Yoshiharu Harada, Okazaki, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:

Law Offices of David G. Posz

Primary Examiner:

Boris Chervinsky

Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

A semiconductor device has a case, a printed circuit board, a fin, and a ceramic substrate mounting a semiconductor element thereon. The case contains the printed circuit board, the ceramic substrate and the fin. The fin and the case radiate heat transmitted from the ceramic substrate. The fin has protrusions on a contact face facing a contact face of the case. The fin contacts the case though the protrusions when the fin is fixed to the case. The protrusions serve as heat radiating path.

Find Patent Forward Citations

Fukatsu, Akihiro. (2002). Semiconductor device having heat radiating member (U.S. Patent No. 6434006). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6434006

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…