Obu, Japan

Mitsuhiro Saito

This inventor holds 1 USPTO granted patent. Top assignee: Denso Corporation. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mitsuhiro Saito. Retrieved from https://idiyas.com/inventor/mitsuhiro-saito-pvtfu512

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Mitsuhiro Saito: Innovator in Semiconductor Technology

Introduction

Mitsuhiro Saito is a prominent inventor based in Obu, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative designs that enhance the efficiency and performance of semiconductor devices.

Latest Patents

Mitsuhiro Saito holds a patent for a semiconductor device that features a heat radiating member. This device includes a case, a printed circuit board, a fin, and a ceramic substrate that mounts a semiconductor element. The design allows for effective heat dissipation, as the fin and case work together to radiate heat transmitted from the ceramic substrate. The fin is uniquely designed with protrusions that create a contact face with the case, serving as a heat radiating path.

Career Highlights

Saito is currently employed at Denso Corporation, a leading company in the automotive technology sector. His work at Denso has allowed him to apply his innovative ideas in practical applications, contributing to advancements in semiconductor technology.

Collaborations

Mitsuhiro Saito has collaborated with notable colleagues, including Akihiro Fukatsu and Kan Kinouchi. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Mitsuhiro Saito's contributions to semiconductor technology exemplify the impact of innovation in modern electronics. His patent for a semiconductor device with a heat radiating member showcases his commitment to enhancing device performance and efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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