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Goyang, South Korea

YoRim Lee

This inventor holds 5 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2009-2012.

USPTO Granted Patents = 5

% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 3

Forward Citations = 14(Granted Patents)

Location History:

Kyoung-gi-Do, KR (2009 - 2011)
Koyang-si, KR (2010 - 2012)

Company Filing History:

Stats Chippac Pte. Ltd.

Years Active: 2009-2012

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5 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8143103 - Package stacking system with mold contamination prevention and method for manufacturing thereof (2012-03-27),

2. 7898072 - Package stacking system with mold contamination prevention (2011-03-01),

3. 7875495 - Standoff height improvement for bumping technology using solder resist (2011-01-25),

4. 7682872 - Integrated circuit package system with underfill (2010-03-23),

5. 7615865 - Standoff height improvement for bumping technology using solder resist (2009-11-10),

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