This inventor holds 3 USPTO granted patents. Top assignees: Samsung Electronics Ltd., Samsung Electronics Co., Ltd.. Active years: 2026.
Company Filing History:

Years Active: 2026
Title: Yoonseok Seo: Innovator in Semiconductor Technology
Introduction
Yoonseok Seo is a prominent inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His innovative designs and solutions have advanced the capabilities of semiconductor packages.
Latest Patents
Yoonseok Seo's latest patents include a semiconductor package that features a base substrate with a first and second package mounted apart from each other. This design incorporates connection pads on each surface of the second package, corresponding to a package ball map arranged in rows and columns. The package ball map includes a first signal, or data signal, and a second signal, or command signal, ensuring that the first signal is arranged apart from the second signal. Another notable patent is for a package substrate that consists of multiple sequentially stacked insulating layers, a first signal line for transmitting signals, and a ground line. This innovative design enhances the efficiency and reliability of semiconductor packages.
Career Highlights
Throughout his career, Yoonseok Seo has worked with leading companies in the technology sector, including Samsung Electronics Ltd. and Samsung Electronics Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.
Collaborations
Yoonseok Seo has collaborated with notable colleagues such as Sangkyu Kim and Yechung Chung. These partnerships have fostered a creative environment that has led to the development of innovative solutions in the semiconductor field.
Conclusion
Yoonseok Seo's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in semiconductor packaging and design.