The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Apr. 13, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sangwook Park, Suwon-si, KR;
Sangkyu Kim, Suwon-si, KR;
Yoonseok Seo, Suwon-si, KR;
Sangnam Jeong, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a base substrate, and a first package and a second package mounted apart from each other on an upper surface of the base substrate in a horizontal directions. The second package includes, on each surface thereof, connection pads corresponding to a package ball map including cells, arranged in a plurality of rows and a plurality of columns, each of which has one signal arranged therein. The package ball map includes a first signal, or a data signal, arranged in at least some cells among the cells of the package ball map, and a second signal, or a command or address signal, and the first signal is arranged apart from the second signal.