The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Mar. 22, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A package substrate includes a plurality of sequentially stacked insulating layers, a first signal line configured to transmit a first signal therethrough, and a ground line. The first signal line including a first signal via at least partially penetrating the plurality of insulating layers, a first signal pad provided at one end of the first signal via in any selected one of the insulating layers, and a first signal wiring extending from the first signal pad in the selected insulating layer. The ground line including a ground via at least partially penetrating the plurality of insulating layers, a ground pad provided at one end of the ground via in the selected insulating layer, a ground wiring extending from the ground pad in the selected insulating layer, and a ground stub extending from the ground pad toward the first signal via or the first signal pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile