Location History:
- Asan-si, KR (2012 - 2016)
- Hwaseong-si, KR (2018 - 2020)
- Cheonan-si, KR (2020)
Company Filing History:
Years Active: 2012-2020
Title: Yong-Je Lee: Innovator in Semiconductor Technology
Introduction
Yong-Je Lee is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative packaging solutions for semiconductor chips, which are crucial for the advancement of electronic devices.
Latest Patents
One of Yong-Je Lee's latest patents is a semiconductor package that includes multiple semiconductor chips. This invention features a package substrate with at least one first semiconductor chip and at least one second semiconductor chip, which are spaced apart and have different heights. Additionally, it includes a support structure designed to enhance the stability of the stacked chips. Another notable patent is a method of manufacturing a multi-chip package. This method involves a package substrate with semiconductor chips stacked on it, utilizing conductive wires to connect the chips effectively.
Career Highlights
Yong-Je Lee is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor packaging, contributing to the company's reputation for innovation and quality in electronic components.
Collaborations
Throughout his career, Yong-Je Lee has collaborated with notable colleagues, including Won-Gil Han and Byong-Joo Kim. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Yong-Je Lee's contributions to semiconductor technology exemplify the spirit of innovation. His patents and work at Samsung Electronics Co., Ltd. highlight his role as a key player in advancing electronic device capabilities.