The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2020
Filed:
Nov. 01, 2018
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Won-Gil Han, Cheongju-si, KR;
Seung-Lo Lee, Asan-si, KR;
Yong-Je Lee, Cheonan-si, KR;
Sung-Il Cho, Asan-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a package substrate, at least one first semiconductor chip on the package substrate and having a first height as measured from the package substrate, at least one second semiconductor chip on the package substrate spaced apart from the first semiconductor chip and having a second height less than the first height as measured from the package substrate, at least one third semiconductor chip stacked on the first and second semiconductor chips, and at least one support structure between the at least one second semiconductor chip and the at least one third semiconductor chip configured to support the at least one third semiconductor chip.