This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2020
Title: Seung-Lo Lee: Semiconductor Packaging Inventor.
Introduction
Seung-Lo Lee is an inventor based in Asan, South Korea. His work includes semiconductor packaging, with a patent describing a package that accommodates multiple semiconductor chips at different heights.
Latest Patents
Lee is associated with 1 patent: “Semiconductor Package Including Multiple Semiconductor Chips and Method of Manufacturing the Semiconductor Package.” The invention describes a package substrate carrying first and second semiconductor chips, with the second chip shorter than the first. A third chip is stacked above them, and a support structure between the second and third chips helps support the upper chip.
Career Highlights
Lee is associated with Samsung Electronics Co., Ltd. His patent focuses on arranging and supporting multiple chips within a semiconductor package.
Collaborations
Lee’s listed coworkers include Won-Gil Han and Sung-Il Cho.
Conclusion
Seung-Lo Lee’s patent reflects his contribution to semiconductor packaging through a design that supports stacked chips of differing heights.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile