Company Filing History:
Years Active: 2016
Title: Yong Du - Innovator in Wire-Bonding Technology
Introduction
Yong Du is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of wire-bonding technology, showcasing his expertise through his innovative patent.
Latest Patents
Yong Du holds a patent for a wire-bonding apparatus and method of wire bonding. This invention includes a capillary through which a wire is inserted, a nonsticking determination circuit, and a controller. The nonsticking determination circuit applies a predetermined alternating-current electrical signal between the wire held by the capillary and the bonding target. It obtains a capacitance value between the wire and the bonding target, determining that the wire is disconnected from the bonding target when the capacitance value decreases after the first bonding operation. Furthermore, it identifies that the disconnected wire drops down and contacts the bonding target when the capacitance value returns to its original value before reaching the second bonding point.
Career Highlights
Yong Du is currently employed at Shinkawa Ltd., where he continues to develop and refine his innovative technologies. His work has positioned him as a key player in the advancement of wire-bonding methods.
Collaborations
Yong Du collaborates with talented coworkers, including Naoki Sekine and Motoki Nakazawa. Their combined efforts contribute to the innovative environment at Shinkawa Ltd.
Conclusion
Yong Du's contributions to wire-bonding technology through his patent demonstrate his innovative spirit and technical expertise. His work continues to influence the industry and pave the way for future advancements.