Shinkawa Ltd.

Yong Du

Naoki Sekine

Motoki Nakazawa

Provided is a wire-bonding apparatusincluding a capillarythrough which a wireis inserted, a nonsticking determination circuit, and a controller. The nonsticking determination circuitapplies a predetermined alternating-current electrical signal between the wire held by the capillary and the bonding target, obtains a capacitance value between the wire held by the capillary and the bonding target, determines that the wire is disconnected from the bonding target when the capacitance value decreases after the first bonding operation, and determines that the disconnected wire drops down and is brought into contact with the bonding target when the capacitance value returns to an original value before reaching the second bonding point.

Growing community of inventors

Tokyo, Japan

Yong Du