The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
May. 15, 2015
Shinkawa Ltd., Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
Provided is a wire-bonding apparatusincluding a capillarythrough which a wireis inserted, a nonsticking determination circuit, and a controller. The nonsticking determination circuitapplies a predetermined alternating-current electrical signal between the wire held by the capillary and the bonding target, obtains a capacitance value between the wire held by the capillary and the bonding target, determines that the wire is disconnected from the bonding target when the capacitance value decreases after the first bonding operation, and determines that the disconnected wire drops down and is brought into contact with the bonding target when the capacitance value returns to an original value before reaching the second bonding point.