This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2020
Title: Yoko Sekihara: Innovator in Electronic Packaging
Introduction
Yoko Sekihara is a notable inventor based in Ibaraki, Japan. She has made significant contributions to the field of electronic packaging, showcasing her innovative spirit through her patented inventions.
Latest Patents
Yoko holds a patent for a technology related to through-mold structures. This patent describes an electronic package assembly that includes a substrate with a conductive layer, a die coupled to the conductive layer, and a contact block with distinct contact surfaces. The design allows for enhanced connectivity and functionality in electronic devices, demonstrating her expertise in the field.
Career Highlights
Yoko Sekihara is currently employed at Intel Corporation, where she continues to push the boundaries of innovation in electronic packaging. Her work has been instrumental in developing advanced technologies that improve the performance and reliability of electronic components.
Collaborations
Throughout her career, Yoko has collaborated with talented professionals, including Sasha N Oster and Srikant Nekkanty. These collaborations have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Yoko Sekihara's contributions to electronic packaging through her innovative patents and work at Intel Corporation highlight her as a leading figure in the field. Her dedication to advancing technology continues to inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile