Yiying Kuo

Title: Yiying Kuo: Innovator in Sensor Technology

Introduction

Yiying Kuo is a prominent inventor based in Taoyuan, Taiwan. She has made significant contributions to the field of sensor technology, holding a total of 2 patents. Her work focuses on innovative packaging solutions for sensors, which are crucial in various electronic applications.

Latest Patents

Yiying Kuo's latest patents include a "Sensor Die Package" and a "WLCSP with Transparent Substrate and Method of Manufacturing the Same." The Sensor Die Package patent describes a package that features a transparent layer covering a sensor die, along with multiple electrical connections extending from one surface of the package to the opposite surface. This design enhances the functionality and efficiency of sensor integration. The WLCSP patent outlines a wafer-level chip scale package that utilizes a transparent substrate, allowing for effective mounting within electronic devices or printed circuit boards. These innovations reflect her commitment to advancing sensor technology.

Career Highlights

Yiying Kuo is currently employed at STMicroelectronics GmbH, where she continues to develop cutting-edge technologies. Her work has been instrumental in enhancing the performance and reliability of electronic components.

Collaborations

Yiying collaborates with her coworker, David Gani, to further innovate in the field of sensor technology. Their combined expertise contributes to the success of their projects and the advancement of their company's goals.

Conclusion

Yiying Kuo is a remarkable inventor whose contributions to sensor technology are noteworthy. Her patents demonstrate her innovative spirit and dedication to improving electronic devices. Her work at STMicroelectronics GmbH continues to influence the industry positively.