Ying-Chih Chan

Title: Innovations of Ying-Chih Chan

Introduction

Ying-Chih Chan is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of technology, particularly in the development of advanced substrates for electronic applications. With a total of 8 patents to his name, Chan's work has had a substantial impact on the industry.

Latest Patents

One of his latest patents is for a carrier substrate that includes a dielectric layer, a first circuit layer, an insulation layer, conductive blocks, and a first conductive structure. The dielectric layer features a first surface, a second surface, and blind vias. The first circuit layer is embedded in the first surface, and the blind vias extend from the second surface to the first circuit layer. The insulation layer is positioned on the first surface and has a third surface, a fourth surface, and first openings that expose the first circuit layer. The conductive blocks fill these openings and connect with the first circuit layer, with the top surface of each conductive block being higher than the third surface of the insulation layer. The first conductive structure consists of conductive vias that fill the blind vias and a second circuit layer that is placed on a portion of the second surface.

Another notable patent involves a packaging substrate featuring a through-holed interposer. This interposer includes a board body, a conductive gel formed within the board body, and a circuit redistribution structure that is situated on the board body. The conductive gel has one end that protrudes from the surface of the board body, and the area of the protruded end that contacts other structures is increased. This design enhances the bonding of the conductive gel and improves the reliability of the interposer.

Career Highlights

Ying-Chih Chan is currently employed at Unimicron Technology Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of electronic substrates.

Collaborations

Chan has collaborated with notable colleagues, including Tzyy-Jang Tseng and Dyi-Chung Hu, contributing to various projects and innovations in the field.

Conclusion

Ying-Chih Chan's contributions to technology through his patents and work at Unimicron Technology Corporation highlight his role as a leading inventor in the industry. His innovative designs continue to shape the future of electronic applications.