The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2015

Filed:

Sep. 05, 2013
Applicant:

Unimicron Technology Corporation, Taoyuan, TW;

Inventors:

Chun-Ting Lin, Taoyuan, TW;

Yu-Chung Hsieh, Taoyuan, TW;

Ying-Tung Wang, Taoyuan, TW;

Ying-Chih Chan, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 2224/1132 (2013.01); H01L 2224/1161 (2013.01); H01L 2224/11422 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/11823 (2013.01); H01L 2224/11825 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/1369 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/13583 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13664 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81192 (2013.01); H05K 3/4007 (2013.01);
Abstract

A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.


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