The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Mar. 09, 2015
Applicant:

Unimicron Technology Corporation, Taoyuan, TW;

Inventors:

Tzyy-Jang Tseng, Taoyuan, TW;

Dyi-Chung Hu, Taoyuan, TW;

Ying-Chih Chan, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H05K 1/11 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/486 (2013.01); H01L 21/4867 (2013.01); H01L 21/56 (2013.01); H01L 21/563 (2013.01); H01L 21/768 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H05K 1/115 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.


Find Patent Forward Citations

Loading…