Company Filing History:
Years Active: 2016-2017
Title: Innovations of Yin-Hua Chen
Introduction
Yin-Hua Chen is a notable inventor based in Yuanlin, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of devices with advanced through-substrate via (TSV) structures. With a total of 2 patents, his work has implications for improving the performance and efficiency of electronic devices.
Latest Patents
Yin-Hua Chen's latest patents include innovative methods for forming devices with capped through-substrate via structures. The first patent describes a device that features a first dielectric layer on a semiconductor substrate, a gate electrode formed within this layer, and a TSV structure that penetrates both the dielectric layer and the semiconductor substrate. This TSV structure is composed of a conductive layer, a diffusion barrier layer surrounding it, and an isolation layer encasing the barrier. A capping layer made of cobalt is formed on the top surface of the conductive layer. The second patent mirrors these features, emphasizing the importance of the TSV structure in modern semiconductor devices.
Career Highlights
Yin-Hua Chen is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to push the boundaries of semiconductor technology and contribute to advancements that benefit the entire industry.
Collaborations
Yin-Hua Chen has collaborated with several talented individuals, including Yung-Chi Lin and Yen-Hung Chen, who is a woman. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Yin-Hua Chen's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced electronic devices, showcasing the importance of innovation in technology.