This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Asm Assembly Automation Limited. Active years: 2011-2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2011-2014
Title: Innovations of Yin Fun Ng in Die Bonding Technology
Introduction
Yin Fun Ng is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of die bonding technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and effectiveness of die bonding processes.
Latest Patents
Yin Fun Ng's latest patents include innovative designs for die bonders. The first patent describes a die bonder that provides a large bonding force. This device features a bond head with a collet for picking up a die and bonding it at a designated site. It incorporates a first motor connected to the collet via a shaft, allowing movement towards and away from the bonding site. Additionally, a second motor drives the bond head in parallel directions, while a rotary motor enables the collet to rotate about a rotational axis. The design ensures that the shaft is slidably connected to the rotary motor, facilitating smooth operation.
The second patent presents a rotary bonding tool that also provides a large bond force. This die bonder includes a bond head with a load shaft that passes through it, with a collet at one end for holding the die. A bond force motor drives the load shaft along a travel axis, while a rotary motor rotates the load shaft about a rotational axis. A coupler with a bearing connects the load shaft to the bond force motor, allowing for rotation relative to the motor.
Career Highlights
Yin Fun Ng is currently employed at Asm Assembly Automation Limited, where he continues to innovate in the field of assembly automation. His expertise in die bonding technology has positioned him as a key player in the industry.
Collaborations
Yin has collaborated with notable coworkers, including Hon Chiu Hui and Gary Peter Widdowson, contributing to a dynamic work environment that fosters innovation.
Conclusion
Yin Fun Ng's contributions to die bonding technology through his patents reflect his commitment to advancing the field. His work at Asm Assembly Automation Limited continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile