The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Sep. 02, 2009
Applicants:
Yin Fun NG, Hong Kong, CN;
Gary Peter Widdowson, Hong Kong, CN;
Hon Chiu Hui, Hong Kong, CN;
Inventors:
Assignee:
ASM Assembly Automation Ltd, Hong Kong, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/80 (2006.01);
U.S. Cl.
CPC ...
Abstract
A die bonder comprises a bond head having a load shaft which passes through the bond head and a collet located at one end of the load shaft for holding a die to be bonded. A bond force motor is operative to drive the load shaft along a travel axis in directions towards and away from a die bonding position. A rotary motor is operative to rotate the load shaft about a rotational axis parallel to the travel axis. A coupler which comprises a bearing couples the load shaft to the bond force motor to allow the load shaft to rotate about the rotational axis relative to the bond force motor.