This inventor holds 4 USPTO granted patents. Top assignee: Asm Assembly Automation Limited. Active years: 2006-2014.
Location History:
- Kwai Chung, CN (2007)
- Hong Kong, CN (2006 - 2014)
Company Filing History:
Years Active: 2006-2014
Title: Hon Chiu Hui: Innovator in Die Bonding Technology
Introduction
Hon Chiu Hui is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of die bonding technology, holding a total of 4 patents. His innovative designs have advanced the efficiency and effectiveness of die bonding processes in the electronics industry.
Latest Patents
Hon Chiu Hui's latest patents include a die bonder that provides a large bonding force. This die bonder features a bond head equipped with a collet for picking up a die and bonding it at a designated site. The design incorporates a first motor connected to the collet by a shaft, allowing for movement towards and away from the bonding site. Additionally, a second motor drives the bond head in parallel directions to the first motor's driving directions. A rotary motor is also connected to the collet, enabling it to rotate about a rotational axis that aligns with the first motor's driving directions.
Another of his recent patents is a rotary bonding tool that also provides a large bond force. This die bonder includes a bond head with a load shaft that passes through it, featuring a collet at one end for holding the die. A bond force motor drives the load shaft along a travel axis, while a rotary motor rotates the load shaft about a rotational axis parallel to the travel axis. A coupler with a bearing connects the load shaft to the bond force motor, allowing for rotation relative to the motor.
Career Highlights
Hon Chiu Hui is currently employed at Asm Assembly Automation Limited, where he continues to innovate in the field of assembly automation. His work has been instrumental in developing advanced bonding technologies that enhance production capabilities.
Collaborations
Hon has collaborated with talented coworkers, including Ka Yee Mak and Wing Fai Lam, contributing to a dynamic and innovative work environment.
Conclusion
Hon Chiu Hui's contributions to die bonding technology exemplify his commitment to innovation and excellence in the field. His patents reflect a deep understanding of engineering principles and a drive to improve manufacturing processes.