Company Filing History:
Years Active: 2016-2025
Title: Yihui Lee: Innovator in Wafer Processing Technologies
Introduction
Yihui Lee is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of wafer processing, holding a total of 3 patents. His innovative methods have advanced the efficiency and effectiveness of processing workpieces and wafers.
Latest Patents
Yihui Lee's latest patents include a method of processing a warped workpiece and a wafer processing method. The method of processing a warped workpiece involves applying a laser beam to eliminate warpage by forming modified layers and cracks that extend to the lower surface of the workpiece. This innovative approach ensures that the workpiece is effectively processed without warpage. The wafer processing method focuses on dividing a wafer into individual device chips along division lines. This method includes a back grinding step and a modified layer forming step, which utilizes a laser beam to create modified layers along each division line, ultimately allowing for the efficient division of the wafer.
Career Highlights
Yihui Lee is currently employed at Disco Corporation, where he continues to develop and refine his innovative techniques in wafer processing. His work has garnered attention for its practical applications in the semiconductor industry.
Collaborations
Some of Yihui Lee's notable coworkers include Yohei Yamashita and Kenji Furuta. Their collaboration has contributed to the advancement of technologies in their field.
Conclusion
Yihui Lee's contributions to wafer processing technologies demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in the industry and provide effective solutions to enhance processing methods.