Yi-Wei Liu

Title: Yi-Wei Liu: Innovator in Chip Package Structures

Introduction

Yi-Wei Liu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His innovative designs have advanced the technology used in chip packaging, making them more efficient and reliable.

Latest Patents

One of Yi-Wei Liu's latest patents is a chip package structure that includes a substrate with a first surface and a second surface opposite to the first. This structure features a first chip structure and a second chip structure positioned over the first surface. A protective layer surrounds both chip structures, with a portion of this layer located between them. Additionally, the design incorporates a first anti-warpage bump on the second surface, which extends across the protective layer. A conductive bump is also included, which is electrically connected to either the first or second chip structure. Notably, the first anti-warpage bump is wider than the conductive bump, enhancing the overall stability of the package.

Career Highlights

Yi-Wei Liu has worked with leading companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Ltd. and Siliconware Precision Industries Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in chip packaging technology.

Collaborations

Throughout his career, Yi-Wei Liu has collaborated with talented individuals such as Kuan-Yu Huang and Sung-Hui Huang. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Yi-Wei Liu's contributions to the field of chip packaging are noteworthy and reflect his dedication to innovation. His patents and collaborations continue to influence the semiconductor industry, showcasing his role as a key inventor in this vital area of technology.