Taichung, Taiwan

Yi-Lin Tsai

This inventor holds 8 USPTO granted patents and 3 published patent applications. Top assignees: International Business Machines Corporation, Siliconware Precision Industries Co., Ltd.. Active years: 2018-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yi-Lin Tsai. Retrieved from https://idiyas.com/inventor/yi-lin-tsai-klte0fle

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8 

% Patents Active = 50.0

Average Co-Inventor Count = 4.4

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2018-2025

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8 patents (USPTO):Explore Patents

Title: Yi-Lin Tsai: Innovator in Electronic Packaging Technology

Introduction

Yi-Lin Tsai is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 8 patents. His innovative work focuses on improving the efficiency and reliability of electronic components.

Latest Patents

Among his latest patents, Yi-Lin Tsai has developed an electronic package and substrate structure that enhances the performance of electronic devices. This electronic package includes a substrate structure, an electronic element, and an encapsulation layer that effectively encapsulates the electronic element. A key feature of this invention is the formation of at least one functional circuit on the substrate body, along with a wire arranged strategically to create an exhaust passage during the encapsulation process. This design helps to prevent issues such as voids or overflows in the encapsulation layer. Another notable patent involves a substrate structure with an insulating protection layer that has openings corresponding to electrical contact pads. This design reduces the barrier of the insulating protection layer, thereby improving the overall functionality of the electronic package.

Career Highlights

Yi-Lin Tsai has worked with notable companies in the technology sector, including IBM and Siliconware Precision Industries Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in electronic packaging.

Collaborations

Throughout his career, Yi-Lin Tsai has collaborated with esteemed colleagues such as Der-Joung Wang and Yen-Min Wu. These partnerships have fostered a creative environment that has led to innovative solutions in the field.

Conclusion

Yi-Lin Tsai's contributions to electronic packaging technology are noteworthy and impactful. His patents reflect a commitment to innovation and excellence in the industry. His work continues to influence the development of more efficient electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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