The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2025
Filed:
Jul. 06, 2022
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Wen-Chen Hsieh, Taichung, TW;
Ya-Ting Chi, Taichung, TW;
Chia-Wen Tsao, Taichung, TW;
Hsin-Yin Chang, Taichung, TW;
Yi-Lin Tsai, Taichung, TW;
Hsiu-Fang Chien, Taichung, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Abstract
An electronic package is provided and includes a substrate structure, an electronic element disposed on the substrate structure and an encapsulation layer encapsulating the electronic element, where at least one functional circuit is formed on a surface of a substrate body of the substrate structure, and a wire having a smaller width is arranged on a boundary line at a junction between an encapsulation area and a peripheral area, so that when a mold for forming the encapsulation layer is formed to cover the substrate structure, the mold will create a gap around the wire to serve as an exhaust passage. Therefore, when the encapsulation layer is formed, the exhaust passage can be used to exhaust air, so as to avoid problems such as the occurrence of voids or overflows of the encapsulation layer.