Yi-Hang Lin

Title: Yi-Hang Lin: Innovator in Chip Packaging Technology

Introduction

Yi-Hang Lin is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of 3 patents. His innovative work has paved the way for advancements in semiconductor packaging.

Latest Patents

One of Yi-Hang Lin's latest patents is titled "Chip package and method for forming the same." This invention provides a chip package that includes a carrier substrate and a semiconductor substrate with an upper and lower surface. The semiconductor substrate is disposed over the carrier substrate and features a device region or sensing region located on its upper surface. Additionally, a conducting pad is situated on the upper surface of the semiconductor substrate, along with a conducting layer that is electrically connected to the conducting pad. This conducting layer extends from the upper surface of the semiconductor substrate to its sidewall, with an insulating layer positioned between the conducting layer and the semiconductor substrate.

Career Highlights

Throughout his career, Yi-Hang Lin has worked with Xintec Corporation, where he has further honed his skills in semiconductor technology. His experience in this field has allowed him to develop innovative solutions that address the challenges of modern chip packaging.

Collaborations

Yi-Hang Lin has collaborated with notable professionals in the industry, including Chao-Yen Lin. These collaborations have contributed to the advancement of technology in chip packaging.

Conclusion

Yi-Hang Lin's contributions to chip packaging technology demonstrate his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving semiconductor technology, making him a noteworthy inventor in the industry.