This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2000.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2000
Title: Innovations of Yi-Fei Wang in High Aspect Ratio Metal Etching
Introduction
Yi-Fei Wang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of high aspect ratio etching. His innovative approaches have paved the way for advancements in ultra-large scale integrated chips.
Latest Patents
Yi-Fei Wang holds a patent titled "Film scheme to solve high aspect ratio metal etch masking layer." This patent describes a method of high aspect ratio etching (HARE) of metal layers in quarter micron technology. The invention addresses the challenges posed by shrinking lateral dimensions while maintaining the thickness of features in integrated circuits. The method employs a tungsten W-hardmask with a high selectivity of 10:1 relative to the underlying aluminum-copper metal layer. To protect lithographic integrity, an overlying organic BARC is utilized to prevent reflections from both the W-hardmask and the underlying metal layer. The lithographic resolution is enhanced by using a thin photoresist layer in conjunction with the high selectivity hardmask. This innovative approach circumvents the typical tradeoff between high resolution processes and reliable metal etching.
Career Highlights
Yi-Fei Wang is currently associated with Taiwan Semiconductor Manufacturing Company Ltd. His work has been instrumental in advancing semiconductor manufacturing techniques. With a focus on high aspect ratio etching, he has contributed to the development of more efficient and effective processes in the industry.
Collaborations
Yi-Fei Wang has collaborated with notable colleagues, including Cheng-Hao Huang and Wen-Hsiang Tang. These collaborations have fostered a productive environment for innovation and have led to significant advancements in their respective fields.
Conclusion
Yi-Fei Wang's contributions to high aspect ratio metal etching represent a significant advancement in semiconductor technology. His innovative methods and collaborative efforts continue to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile