The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2000

Filed:

Jan. 19, 1999
Applicant:
Inventors:

Wen-Hsiang Tang, Taipei, TW;

Yi-Fei Wang, Taipei, TW;

Chih-Shen Hung, Hsin-Chu, TW;

Cheng-Hao Huang, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03C / ; H01L / ; B44C / ;
U.S. Cl.
CPC ...
430313 ; 430316 ; 438723 ; 216 43 ; 216 47 ; 216 41 ;
Abstract

A method of high aspect ratio etching (HARE) of metal layers in quarter micron technology is disclosed. High aspect ratio patterns are encountered because of the shrinking lateral dimensions over the constant remaining thickness of the features of ultra large scaled integrated chips. HARE is accomplished by employing a tungsten W-hardmask with a high selectivity of 10:1 with respect to the immediately underlying aluminum-copper metal layer. In order to protect the lithographic integrity, overlying organic BARC is used to prevent reflections from the W-hardmask as well as from the underlying metal layer. The lithographic resolution is further improved by using a thin photoresist layer in combination with the high selectivity hardmask. In this manner, the tradeoff that normally has to be made between a high resolution process and a reliable metal etch is circumvented.


Find Patent Forward Citations

Tang, Wen-Hsiang. (2000). Film scheme to solve high aspect ratio metal etch masking layer (U.S. Patent No. 6156485). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6156485

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