Company Filing History:
Years Active: 2014
Title: Yi-Chi Lai: Innovator in Semiconductor Packaging
Introduction: Yi-Chi Lai is a prominent inventor based in Taichung Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of packaging solutions. His innovative approach has led to advancements that enhance product reliability and reduce manufacturing costs.
Latest Patents: Yi-Chi Lai holds a patent for a semiconductor package and its fabrication method. This invention includes a semiconductor substrate with opposite first and second surfaces, an adhesive layer on the first surface, and at least one semiconductor chip placed on the adhesive layer. The encapsulant formed on the adhesive layer encapsulates the semiconductor chip, while a plurality of conductive posts penetrate both surfaces of the substrate and the adhesive layer, ensuring electrical connectivity to the semiconductor chip. This design effectively reduces fabrication costs, shortens production time, and improves overall product reliability. He has 1 patent to his name.
Career Highlights: Yi-Chi Lai is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work at this organization has allowed him to contribute to cutting-edge technologies and innovations in semiconductor manufacturing.
Collaborations: Throughout his career, Yi-Chi Lai has collaborated with talented individuals such as Mu-Hsuan Chan and Wan-Ting Chen. These partnerships have fostered a creative environment that encourages the development of innovative solutions in semiconductor technology.
Conclusion: Yi-Chi Lai's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in the field. His patent reflects a significant advancement that benefits the industry, showcasing his role as a key inventor in this domain.