Siliconware Precision Industries Co., Ltd.

Yi-Chi Lai

Chun-Tang Lin

Mu-Hsuan Chan

Yi-Chian Liao

Wan-Ting Chen

A semiconductor package is provided, which includes: a semiconductor substrate having opposite first and second surfaces; an adhesive layer formed on the first surface of the semiconductor substrate; at least a semiconductor chip disposed on the adhesive layer; an encapsulant formed on the adhesive layer for encapsulating the semiconductor chip; and a plurality of conductive posts penetrating the first and second surfaces of the semiconductor substrate and the adhesive layer and electrically connected to the semiconductor chip, thereby effectively reducing the fabrication cost, shortening the fabrication time and improving the product reliability.

Growing community of inventors

Taichung Hsien, Taiwan

Yi-Chi Lai