Yeong Beom Ko

Title: Yeong Beom Ko and Semiconductor Packaging Innovation.

Introduction

Yeong Beom Ko is an inventor associated with Suwon-si, South Korea, and Samsung Electronics Co., Ltd. The available information credits Ko with 1 patent, focused on semiconductor packaging.

Latest Patents

Ko’s listed patent, “Semiconductor Package and Method of Fabricating the Same,” describes a package architecture that combines semiconductor chips, dummy chips, through vias, bonding pads, and an insulating layer. A first semiconductor chip is positioned above a second semiconductor chip and two dummy chips. Through vias penetrate the chips and dummy chips to provide electrical connections to the first semiconductor chip, while bonding pads join the components. The insulating layer lies beneath the second semiconductor chip and both dummy chips, and the through vias penetrate it.

Career Highlights

The patent reflects work on semiconductor package structure and fabrication, including the arrangement of chips, electrical pathways, and bonding interfaces. Ko’s listed affiliation is Samsung Electronics Co., Ltd.

Collaborations

The available information identifies Samsung Electronics Co., Ltd. as Ko’s company affiliation. It does not specify additional collaborators or co-inventors for the listed patent.

Conclusion

Yeong Beom Ko’s listed patent addresses semiconductor packaging through an integrated arrangement of chips, vias, bonding pads, and insulation, highlighting a contribution to packaging design at Samsung Electronics Co., Ltd.