The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Apr. 17, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jun Yun Kweon, Suwon-si, KR;
Yeong Beom Ko, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a first semiconductor chip, first and second dummy chips below the first semiconductor chip, a second semiconductor chip between the first and second dummy chips, a first through via penetrating the second semiconductor chip and electrically connected to the first semiconductor chip, second and third through vias penetrating the first and second dummy chips, respectively, and each electrically connected to the first semiconductor chip, a first bonding pad bonding the first semiconductor chip to the second semiconductor chip, a second bonding pad bonding the first semiconductor chip to the first dummy chip, a third bonding pad bonding the first semiconductor chip to the second dummy chip, and a first insulating layer below the second semiconductor chip and below the first and second dummy chips with each of the first, second, and third through vias penetrating the first insulating layer.