Yeon Sun Na

Title: Yeon Sun Na: Innovator in Printed Circuit Board Technology

Introduction

Yeon Sun Na is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of electronic devices, particularly in the development of printed circuit boards and display devices. With a total of 2 patents, his work showcases innovative solutions that enhance electronic device functionality.

Latest Patents

Yeon Sun Na's latest patents include two notable inventions. The first patent focuses on a printed circuit board and display device that incorporates a unique design. This design features a first insulating layer, a metal layer, and a second insulating layer, with signal lines extending in a specific direction. The metal layer includes open areas that overlap the signal lines, which can also be replaced with metal meshes in alternative embodiments.

The second patent outlines a method for mounting electronic devices using a printed circuit board. This method involves preparing a base substrate with connection pads and a solder resist. It details the process of disposing preliminary bumps and under-fill patterns, followed by the mounting of an electronic device through reflowing techniques. The method emphasizes the use of an under-fill film that enhances the mounting process.

Career Highlights

Yeon Sun Na is currently employed at Samsung Display Co., Ltd., where he continues to innovate in the field of electronic devices. His work at Samsung has positioned him as a key player in advancing technology related to display devices and printed circuit boards.

Collaborations

Throughout his career, Yeon Sun Na has collaborated with talented individuals such as Min Soo Choi and Jeong Hun Go. These collaborations have contributed to the successful development of his patents and innovations.

Conclusion

Yeon Sun Na's contributions to the field of printed circuit boards and electronic devices highlight his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving electronic device functionality and efficiency.