Samsung Display Co., Ltd.

Yeon Sun Na

Hyun Seok Hong

Min Soo Choi

Jeong Hun Go

Jeong Mo Nam

An embodiment of a printed circuit board includes a first insulating layer, a metal layer disposed above the first insulating layer, a second insulating layer disposed above the metal layer, and signal lines disposed above the second insulating layer, the signal lines extending in a first direction and having line widths in a second direction perpendicular to the first direction. The metal layer has open areas overlapping the signal lines in a third direction perpendicular to the first and second directions. In another embodiment, the open areas are replaced with metal meshes.

Printed circuit board and display device including the same

A method of mounting an electronic device includes: preparing a printed circuit board including a base substrate, connection pads disposed on the base substrate and spaced apart from each other, and a solder resist including contact holes exposing a portion of the connection pads; disposing preliminary bumps on the exposed portion of the connection pads via the contact holes; disposing under-fill patterns in areas between the preliminary bumps on the solder resist; disposing an electronic device on the preliminary bumps and the under-fill patterns; and mounting the electronic device onto the printed circuit board by reflowing the preliminary bumps and the under-fill patterns. The disposing of the under-fill patterns may include: providing an under-fill film including a base film having openings spaced apart from each other, and the under-fill patterns disposed within the openings; applying pressure to the under-fill film; and removing the base film from the under-fill film.

Growing community of inventors

Yongin-si, South Korea

Yeon Sun Na