The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 23, 2024
Filed:
May. 20, 2021
Applicant:
Samsung Display Co., Ltd., Yongin-Si, KR;
Inventors:
Yeon Sun Na, Yongin-si, KR;
Min Soo Choi, Yongin-si, KR;
Assignee:
Samsung Display Co., Ltd., Yongin-Si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 25/18 (2023.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0245 (2013.01); H01L 25/18 (2013.01); H05K 1/0225 (2013.01); H05K 1/148 (2013.01); H05K 1/189 (2013.01); H05K 2201/049 (2013.01); H05K 2201/0723 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10128 (2013.01);
Abstract
An embodiment of a printed circuit board includes a first insulating layer, a metal layer disposed above the first insulating layer, a second insulating layer disposed above the metal layer, and signal lines disposed above the second insulating layer, the signal lines extending in a first direction and having line widths in a second direction perpendicular to the first direction. The metal layer has open areas overlapping the signal lines in a third direction perpendicular to the first and second directions. In another embodiment, the open areas are replaced with metal meshes.