Boise, ID, United States of America

Yenting Lin

This inventor holds 2 USPTO granted patents. Top assignee: Micron Technology Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yenting Lin. Retrieved from https://idiyas.com/inventor/yenting-lin-9hrs8pqg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Yenting Lin: Semiconductor Inventions at Micron Technology

Introduction

Yenting Lin is an inventor based in Boise, Idaho, whose patent work focuses on semiconductor structures. He is associated with Micron Technology Incorporated and has 2 patents.

Latest Patents

Lin’s listed patents include “Semiconductor Structure with Curved Surfaces” and “Semiconductor Structure with Nitride Caps.”

“Semiconductor Structure with Curved Surfaces” describes a patterned semiconductor structure with active areas, conductive and metal materials, and nitride materials that separate components. A curved surface is formed on part of the metal and nitride materials, and an oxide-containing layer contacts that surface. The patent describes an apparatus and related methods and systems.

Career Highlights

Lin’s patent portfolio reflects work on semiconductor structures and materials. His association with Micron Technology connects his inventions to the company’s semiconductor technology efforts.

Collaborations

The provided information identifies Micron Technology Incorporated as Lin’s company but does not specify particular collaborators or joint research projects.

Conclusion

Yenting Lin’s two listed patents address semiconductor structures, including designs involving curved surfaces and nitride caps, and represent his documented inventive work associated with Micron Technology Incorporated.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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