Company Filing History:
Years Active: 2023-2025
Title: Innovations by Yen-Chieh Tu
Introduction
Yen-Chieh Tu is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer bonding alignment. With a total of two patents to his name, Tu's work has implications for improving the efficiency and effectiveness of semiconductor manufacturing processes.
Latest Patents
Yen-Chieh Tu's latest patents focus on wafer bonding alignment. The alignment of devices formed on substrates that are to be bonded may be achieved through the use of scribe lines between the devices. These scribe lines progressively increase or decrease in size from a center to an edge of one or more of the substrates. This design compensates for differences in the thermal expansion rates of the substrates. As the substrates are heated during a bonding operation, the devices on the substrates are brought into alignment due to the progressively increased or decreased sizes of the scribe lines. The scribe lines may be arranged in a single direction in a substrate to compensate for thermal expansion along a single axis or may be arranged in a plurality of directions to accommodate actinomorphic thermal expansion.
Career Highlights
Yen-Chieh Tu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in semiconductor technology.
Collaborations
Tu has collaborated with notable coworkers, including Hsi-Cheng Hsu and Jui-Chun Weng, who is a woman. These collaborations have likely enriched his work and contributed to the development of his patents.
Conclusion
Yen-Chieh Tu's contributions to wafer bonding alignment represent significant advancements in semiconductor technology. His innovative approach to addressing thermal expansion challenges showcases his expertise and commitment to improving manufacturing processes.