Taiwan Semiconductor Manufacturing Comp. Ltd.

Yen-Chieh Tu

Jui-Chun Weng

Hsi-Cheng Hsu

Chia-Chun Hung

Ji-Hong Chiang

Ching-Hsiang Hu

Kuo-Hao Lee

Chia-Yu Lin

Chien-Tai Su

Hsin-Yu Chen

Hsin-yu Chen

Alignment of devices formed on substrates that are to be bonded may be achieved through the use of scribe lines between the devices, where the scribe lines progressively increase or decrease in size from a center to an edge of one or more of the substrates to compensate for differences in the thermal expansion rates of the substrates. The devices on the substrates are brought into alignment as the substrates are heated during a bonding operation due to the progressively increased or decreased sizes of the scribe lines. The scribe lines may be arranged in a single direction in a substrate to compensate for thermal expansion along a single axis of the substrate or may be arranged in a plurality of directions to compensate for actinomorphic thermal expansion.

Wafer bonding alignment

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Taichung, Taiwan

Yen-Chieh Tu