The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Mar. 11, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Hsi-Cheng Hsu, Taichung, TW;
Jui-Chun Weng, Taipei, TW;
Ching-Hsiang Hu, Taipei, TW;
Ji-Hong Chiang, Changhua, TW;
Kuo-Hao Lee, Hsinchu, TW;
Chia-Yu Lin, Taoyuan, TW;
Chia-Chun Hung, Chiayi, TW;
Yen-Chieh Tu, Taichung, TW;
Chien-Tai Su, Hsinchu, TW;
Hsin-Yu Chen, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
Alignment of devices formed on substrates that are to be bonded may be achieved through the use of scribe lines between the devices, where the scribe lines progressively increase or decrease in size from a center to an edge of one or more of the substrates to compensate for differences in the thermal expansion rates of the substrates. The devices on the substrates are brought into alignment as the substrates are heated during a bonding operation due to the progressively increased or decreased sizes of the scribe lines. The scribe lines may be arranged in a single direction in a substrate to compensate for thermal expansion along a single axis of the substrate or may be arranged in a plurality of directions to compensate for actinomorphic thermal expansion.