Penang, Malaysia

Yee Choong Lim


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2023

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2 patents (USPTO):Explore Patents

Title: **Innovations by Yee Choong Lim: Pioneering Thermal Management in Multichip Packages**

Introduction

Yee Choong Lim, a notable inventor based in Penang, Malaysia, has made significant contributions to the field of integrated circuits, focusing on managing thermal behavior in complex electronic systems. With a track record of two patents, Lim has helped advance technology that enhances the performance and reliability of multichip packages.

Latest Patents

Yee Choong Lim's most recent patents revolve around advanced methods and apparatus for managing thermal behavior in multichip packages. The integrated circuits he has developed include specialized circuitry designed to access an associated die stack. This innovative approach involves receiving temperature data, alongside various operational parameters, to ascertain the necessity of rerouting access commands or requests to specific dies in the stack. A smart crossbar switch incorporated into the circuitry performs address translation or hashing functions to efficiently map logical user addresses to a physical address space. This thermally aware traffic management is crucial for maintaining acceptable timing margins within the system, thereby minimizing the chances of operational errors and enhancing overall system performance.

Career Highlights

Yee Choong Lim is currently employed at Intel Corporation, a leading technology company renowned for its advancements in semiconductors and integrated circuits. His work focuses on developing cutting-edge technologies that improve thermal management, a critical component in the design of reliable and efficient electronic systems.

Collaborations

Throughout his career, Yee Choong Lim has collaborated with a talented team, including accomplished professionals such as Saravanan Sethuraman and Tonia G. Morris. Their combined expertise contributes to innovative projects and solutions in the field of thermal management and integrated circuit design.

Conclusion

Yee Choong Lim's contributions to thermal management in multichip packages highlight the vital intersection of innovation and practical application in electronics. His patents not only advance the existing technology but also pave the way for future developments in integrated circuit designs, ensuring that electronic devices operate efficiently and reliably under varying thermal conditions. As the field continues to evolve, inventors like Lim play a crucial role in shaping the future of technology.

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