The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Sep. 24, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Saravanan Sethuraman, Palau Pinang, MY;

Tonia Morris, Wendell, NC (US);

Siaw Kang Lai, Penang, MY;

Yee Choong Lim, Penang, MY;

Yu Ying Ong, Penang, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/00 (2006.01); H01L 25/065 (2023.01); G11C 5/02 (2006.01); G06F 12/10 (2016.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G06F 12/10 (2013.01); G11C 5/025 (2013.01); G06F 2212/657 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06589 (2013.01);
Abstract

An integrated circuit may include circuitry for accessing an associated die stack. The circuitry may receive temperature information as well as a plurality of operating parameters that help determine whether it may be desirable to reroute access commands or requests to one or more die in the stack. The circuitry may include a smart crossbar switch that implements an address translation or hashing function to help map the logical user address to a physical address space. Performing thermally aware traffic management in this way can ensure that acceptable timing margins are maintained in the system to minimize the probability of errors.


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