This inventor holds 2 USPTO granted patents. Top assignee: Infineon Technologies Ag. Active years: 2019-2023.
Company Filing History:
Years Active: 2019-2023
Title: Yean Seng Ng: Innovator in Semiconductor Technology
Introduction
Yean Seng Ng is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to electronic device fabrication.
Latest Patents
One of his latest patents is titled "Dual step laser processing of an encapsulant of a semiconductor chip package." This method involves providing an encapsulant with an encapsulation material, using a first laser beam to form a trench in the encapsulant, and then employing a second laser beam to sweep over the surface area of the encapsulant. This innovative technique enhances the efficiency of semiconductor device fabrication. Another patent, "Semiconductor package and method for fabricating a semiconductor package," outlines a process that includes providing a carrier, creating an opening in the carrier, attaching a semiconductor chip, and fabricating an encapsulation body to cover the chip.
Career Highlights
Yean Seng Ng is currently employed at Infineon Technologies AG, where he continues to develop cutting-edge technologies in the semiconductor industry. His work has been instrumental in advancing the methods used in semiconductor packaging and processing.
Collaborations
He collaborates with talented individuals such as Pei Luan Pok and Chau Fatt Chiang, contributing to a dynamic team environment that fosters innovation and creativity.
Conclusion
Yean Seng Ng's contributions to semiconductor technology through his patents and work at Infineon Technologies AG highlight his role as a key innovator in the field. His advancements are paving the way for future developments in electronic devices.