The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2019
Filed:
Dec. 12, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Hock Heng Chong, Melaka, MY;
Sook Woon Chan, Melaka, MY;
Chau Fatt Chiang, Melaka, MY;
Khar Foong Chung, Perak, MY;
Chee Hong Fang, Ipoh, MY;
Muhammat Sanusi Muhammad, Melaka, MY;
Mei Chin Ng, Melaka, MY;
Yean Seng Ng, Melaka, MY;
Pei Luan Pok, Melaka, MY;
Choon Huey Wang, Melaka, MY;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 31/0203 (2014.01); H01L 21/48 (2006.01); H01L 33/64 (2010.01); H01L 21/683 (2006.01); H01L 23/13 (2006.01); H01L 33/54 (2010.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/28 (2013.01); H01L 21/4846 (2013.01); H01L 21/6836 (2013.01); H01L 23/13 (2013.01); H01L 23/3107 (2013.01); H01L 23/562 (2013.01); H01L 24/16 (2013.01); H01L 24/96 (2013.01); H01L 31/0203 (2013.01); H01L 33/642 (2013.01); H01L 23/49827 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 33/54 (2013.01); H01L 2221/68304 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01);
Abstract
A method of fabricating a semiconductor package comprises providing a carrier, fabricating an opening in the carrier, attaching a semiconductor chip to the carrier and fabricating an encapsulation body covering the semiconductor chip.