Infineon Technologies Ag

Yean Seng Ng

Chau Fatt Chiang

Pei Luan Pok

Swee Kah Lee

Mei Chin Ng

Sook Woon Chan

Chee Hong Lee

Hock Heng Chong

Chee Hong Fang

Khar Foong Chung

Choon Huey Wang

Roslie Saini Bin Bakar

Muhammat Sanusi Muhammad

Yu Shien Leong

Jan Sing Loh

A method for fabricating an electronic device includes providing an encapsulant having an encapsulation material, providing a first laser beam and forming a trench into a main surface of the encapsulant by removing the encapsulation material by means of the first laser beam, forming a mask along a portion above the edge of the trench, and providing a second laser beam and sweeping the second laser beam over a surface area of the main surface of the encapsulant, wherein the surface area covers at least an area spatially confined by the trench.

Dual step laser processing of an encapsulant of a semiconductor chip package

A method of fabricating a semiconductor package comprises providing a carrier, fabricating an opening in the carrier, attaching a semiconductor chip to the carrier and fabricating an encapsulation body covering the semiconductor chip.

Semiconductor package and method for fabricating a semiconductor package

Growing community of inventors

Melaka, Malaysia

Yean Seng Ng