Yasuyuki Masuda

Title: Yasuyuki Masuda: Innovator in Robotics and Ultrasonic Bonding Technology

Introduction

Yasuyuki Masuda is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the fields of robotics and ultrasonic bonding technology. With a total of 4 patents to his name, Masuda continues to push the boundaries of innovation in his industry.

Latest Patents

Masuda's latest patents include a non-transitory computer-readable storage medium, a robot transfer time estimation method, and a robot transfer time estimation device. This invention provides a program that enables a computer to execute a process for estimating transfer times of straight transfer paths for a vertical articulated robot. The process involves acquiring transfer times, calculating vectors, and identifying the most similar transfer path to a target path for accurate time estimation. Another notable patent is the ultrasonic bonding apparatus, which features a wiping unit designed to remove pre-cured underfill from the tool surface of a head. This apparatus includes a first driver to press an electronic component onto a substrate and an ultrasonic generator, enhancing the efficiency of the bonding process.

Career Highlights

Yasuyuki Masuda is currently employed at Fujitsu Corporation, where he applies his expertise in robotics and bonding technologies. His work has been instrumental in advancing the capabilities of robotic systems and improving manufacturing processes.

Collaborations

Masuda has collaborated with notable colleagues, including Yukio Ozaki and Jun Matsueda, contributing to various innovative projects within the company.

Conclusion

Yasuyuki Masuda's contributions to robotics and ultrasonic bonding technology exemplify his commitment to innovation. His patents reflect a deep understanding of complex engineering challenges and a drive to create effective solutions.