The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2011
Filed:
Sep. 22, 2009
Yasuyuki Masuda, Kawasaki, JP;
Yukio Ozaki, Kawasaki, JP;
Jun Matsueda, Kawasaki, JP;
Kazuyuki Ikura, Kawasaki, JP;
Taizan Kobayashi, Kawasaki, JP;
Toshinori Kasuga, Kawasaki, JP;
Yasuyuki Masuda, Kawasaki, JP;
Yukio Ozaki, Kawasaki, JP;
Jun Matsueda, Kawasaki, JP;
Kazuyuki Ikura, Kawasaki, JP;
Taizan Kobayashi, Kawasaki, JP;
Toshinori Kasuga, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.