The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 02, 2010
Filed:
Sep. 22, 2009
Yasuyuki Masuda, Kawasaki, JP;
Yukio Ozaki, Kawasaki, JP;
Jun Matsueda, Kawasaki, JP;
Kazuyuki Ikura, Kawasaki, JP;
Taizan Kobayashi, Kawasaki, JP;
Toshinori Kasuga, Kawasaki, JP;
Yasuyuki Masuda, Kawasaki, JP;
Yukio Ozaki, Kawasaki, JP;
Jun Matsueda, Kawasaki, JP;
Kazuyuki Ikura, Kawasaki, JP;
Taizan Kobayashi, Kawasaki, JP;
Toshinori Kasuga, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.