The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Sep. 22, 2009
Yasuyuki Masuda, Kawasaki, JP;
Yukio Ozaki, Kawasaki, JP;
Jun Matsueda, Kawasaki, JP;
Kazuyuki Ikura, Kawasaki, JP;
Taizan Kobayashi, Kawasaki, JP;
Toshinori Kasuga, Kawasaki, JP;
Yasuyuki Masuda, Kawasaki, JP;
Yukio Ozaki, Kawasaki, JP;
Jun Matsueda, Kawasaki, JP;
Kazuyuki Ikura, Kawasaki, JP;
Taizan Kobayashi, Kawasaki, JP;
Toshinori Kasuga, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.