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For the Inventor, By the Inventor

Fukuoka, Japan

Yasuto Onitsuka

This inventor holds 9 USPTO granted patents. Top assignee: Matsushita Electric Industrial Co., Ltd.. Active years: 1996-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yasuto Onitsuka. Retrieved from https://idiyas.com/inventor/yasuto-onitsuka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9

% Patents Active = 77.8

Average Co-Inventor Count = 1.1

ph-index = 6

Forward Citations = 86(Granted Patents)


Company Filing History:

goldMedal9 out of 27,375 
 
Matsushita Electric Industrial Co., Ltd.
 patents

Years Active: 1996-2006

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9 patents (USPTO):Explore Patents
1. 7107672 - Method of mounting electronic parts on a flexible printed circuit board (2006-09-19),
2. 6869491 - Bonding method (2005-03-22),
3. 6618937 - Method of assembling electronic applications and display devices (2003-09-16),
4. 5839645 - Bonding machine of electronic components and bonding method thereof (1998-11-24),
5. 5628660 - Bonding apparatus and bonding method of devices (1997-05-13),
6. 5591295 - Bonding apparatus for electronic components (1997-01-07),
7. 5513792 - Bonding apparatus (1996-05-07),
8. 5501005 - Mounting device of electronic components and a mounting method (1996-03-26),
9. 5501004 - Outer-lead bonding apparatus and method therefor (1996-03-26),

Title: Yasuto Onitsuka: Innovator in Electronic Parts Mounting

Introduction

Yasuto Onitsuka is a prominent inventor based in Fukuoka, Japan. He has made significant contributions to the field of electronics, particularly in the mounting of electronic parts on flexible printed circuit boards. With a total of 9 patents to his name, Onitsuka continues to push the boundaries of innovation in his industry.

Latest Patents

Onitsuka's latest patents include a method of mounting electronic parts on a flexible printed circuit board. This innovative method involves holding a plurality of flexible printed circuit boards on a transfer carrier, which consists of a base plate and a resin layer. Reference pins are strategically positioned to ensure accurate alignment of the boards during the mounting process. Additionally, he has developed a bonding method that allows for the precise pressure bonding of two display panels, enhancing the efficiency of electronic assembly.

Career Highlights

Yasuto Onitsuka has had a distinguished career at Matsushita Electric Industrial Co., Ltd., where he has been instrumental in advancing electronic manufacturing techniques. His work has not only improved production efficiency but has also contributed to the overall quality of electronic products.

Collaborations

Onitsuka has collaborated with fellow inventor Teruaki Nishinaka, further enhancing the innovative capabilities of their projects. Their combined expertise has led to the development of cutting-edge technologies in the electronics sector.

Conclusion

Yasuto Onitsuka's contributions to the field of electronics through his patents and innovative methods have established him as a key figure in the industry. His work continues to influence the way electronic components are manufactured and assembled, paving the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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